SHANGHAI -- VeriSilicon (688521.SH) announced that Hefei Hexagon Semiconductor (Hexagon Semi), an image processing SoC provider, has adopted VeriSilicon’s proven IP portfolio in its high-performance HX77 series image processing SoC. The adopted IPs include the GCNanoUltraV 2.5D Graphics Processing Unit (GPU) IP, DW100 DeWarp Processing IP, and DC9200Nano Display Processing IP. The SoC has successfully taped out, achieving a first-pass silicon success.

The HX77 series is a highly integrated, low-power image processing SoC based on RISC-V architecture, integrating comprehensive video input/output interfaces, image processing, and system control capabilities. By leveraging an innovative heterogeneous computing architecture and sophisticated power management technology, HX77 has successfully achieved a technological breakthrough that enables 2K@60fps output with mere milliwatt-level power consumption. HX77 has also realized the 3DoF hover feature on end devices through spatial computing. In addition, the SoC supports multiple display interfaces, including MIPI, LVDS, and DP/eDP, and can flexibly adapt to various display topologies, enabling dual-screen independent display and other typical AR use cases across various AR/VR glasses and display devices.

The GPU, display processing, and DeWarp IPs provided by VeriSilicon work in close coordination, enabling the HX77 series SoC to perform image buffering and processing without external DDR memory. This significantly reduces system latency and energy consumption, meeting the requirements of AR glasses for a highly integrated display solution. Among them, VeriSilicon’s GCNanoUltraV GPU IP delivers high-performance graphics rendering and multi-layer composition, enabling low-latency and high-quality visual output. The DC9200Nano Display Processing IP supports multiple mainstream display interfaces and flexible display topologies, enabling dual-screen independent output at dual 1080p resolution. The DW100 DeWarp Processing IP provides high-precision image distortion correction and geometric transformation processing, supporting improved visual consistency and stable visual output for AR glasses.

Suker Shu, Founder and CEO of Hexagon Semi said, “The first-pass silicon success of the HX77 series SoC validates its design goals in low power consumption, high integration, and display system flexibility, fulfilling the stringent demands of AI/AR glasses for power efficiency, performance, and compact size. VeriSilicon’s mature and proven IP solutions have provided crucial support in system architecture design, display quality, and development cycle management, accelerating our product rollout for AI/AR glasses applications.”

“Our team has worked closely with Hexagon to enable full-color display in lightweight glasses with ultra-low energy consumption. Through deep optimization at the pixel processing level and collaborative pixel data transmission across multiple IPs, we have significantly reduced energy usage and eliminated the need for external DDR access. For smart glasses with integrated displays, comprehensive pixel-level optimization is essential to deliver both performance and efficiency within strict energy budgets,” said Weijin Dai, Chief Strategy Officer, Executive Vice President and General Manager of IP Division at VeriSilicon. “Our Nano IP portfolio for wearables achieves an optimal balance of power efficiency, performance, and time-to-market through subsystem-level integration and optimization. We look forward to expanding our collaboration with ecosystem partners to drive the large-scale adoption of next-generation smart glasses.”