2025³â 09¿ù 13ÀÏ Åä¿äÀÏ
 
 
  ÇöÀçÀ§Ä¡ > ´º½ºÁö´åÄÄ > Science & Technology

·£¼¶¿þ¾îºÎÅÍ µÅÁöµµ»ì±îÁö... ³ë·ÃÇØÁø »ç±âÇà°¢

 

Á¤Ä¡

 

°æÁ¦

 

»çȸ

 

»ýȰ

 

¹®È­

 

±¹Á¦

 

°úÇбâ¼ú

 

¿¬¿¹

 

½ºÆ÷Ã÷

 

ÀÚµ¿Â÷

 

ºÎµ¿»ê

 

°æ¿µ

 

¿µ¾÷

 

¹Ìµð¾î

 

½Å»óǰ

 

±³À°

 

ÇÐȸ

 

½Å°£

 

°øÁö»çÇ×

 

Ä®·³

 

Ä·ÆäÀÎ
Çѻ츲 ¡®¿ì¸®´Â ÇѽҸ²¡¯ ½Ò ¼Òºñ Ä·ÆäÀÎ ½Ã...
1000¸¸¿øÂ¥¸® Àΰø¿Í¿ì, °Ç°­º¸Çè Áö¿ø ¡®Æò...
- - - - - - -
 

Power Integrations¡¯ HiperLCS-2 Chipset Boosts LLC Converter Efficiency, Slashes Component Count by 40 Percent

Surface-mount LLC chipset delivers 250 W with over 98 percent efficiency and no heatsink; no-load consumption is less than 50 mW
´º½ºÀÏÀÚ: 2022-03-22

HOUSTON-- March 22, 2022 -- Power Integrations (Nasdaq: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced the energy-saving HiperLCS™-2 chipset, a new IC family that dramatically simplifies the design and manufacture of LLC resonant power converters. The new dual-chip solution features an isolation device with a high-bandwidth LLC controller, synchronous rectification driver and FluxLink™ isolated control link, alongside a separate half-bridge power device utilizing Power Integrations’ unique 600 V FREDFETs with lossless current sensing and high- and low-side drivers. Both devices are housed in low-profile InSOP™-24 packages. This highly integrated, energy-efficient architecture eliminates heatsinks and reduces component count by up to 40 percent compared to discrete designs.

Edward Ong, senior product marketing manager at Power Integrations said: "Resonant converters using separate controllers and discrete MOSFETs can be incredibly bulky and are notoriously difficult to manufacture due to their complexity and high component count. We have applied our advanced FREDFETs and magneto-inductive FluxLink technology to the LLC topology, yielding 98 percent efficiency and reducing component count by 40 percent, while eliminating bulky heatsinks and unreliable optocouplers. This enables designers to create compact adapters and open-frame power supplies for TVs, monitors with USB PD ports, all-in-one PCs, game consoles and battery chargers for power tools and e-bikes.”

Resonant converters are typically used wherever an application demands a level of efficiency unachievable with single-switch topologies such as flyback converters. The HiperLCS-2 chipset leverages Power Integrations’ high-speed FluxLink feedback mechanism to avoid the compromises normally associated with the LLC topology, permitting designers to quickly and consistently implement designs with high performance, wide operating range and low component count.

Power supply designs based on the new HiperLCS-2 can achieve no-load input power of less than 50 mW at 400 VDC input and provide a continuously regulated output, easily complying with the world's most stringent no-load and standby efficiency regulations. HiperLCS-2 devices operate at high efficiency across the load range with dissipation so low that direct heat transfer through the FR4 PCB is all that is required, eliminating heatsinks in adapter designs up to 220 W continuous output with up to 170 percent peak power capability. All HiperLCS-2 family members feature self-powered start-up and provide the start-up bias for a PFC stage using the company’s HiperPFS™ ICs. Secondary-side sensing provides less than one percent regulation accuracy across line and load range and across production variations. The use of Power Integrations’ FluxLink technology for safety-isolated high-speed digital feedback control provides much faster transient response and far superior long-term reliability compared to optocouplers.



 Àüü´º½º¸ñ·ÏÀ¸·Î

Boomi Named a Leader and Secures Top Score in Strategy Category in Latest iPaaS Report by Independent Research Firm
MRM Health Raises ¢æ55 Million Series B to Advance Best-in-Class Microbiome-Based Biotherapeutic Product Pipeline
Kioxia Achieves Successful Prototyping of 5TB Large-Capacity and 64GB/s High-Bandwidth Flash Memory Module
UL Solutions Opens First Commercial and Service Robot Testing Laboratory
Helical Fusion Raises JPY 2.3 Billion Series A, Advances Roadmap for World's First Steady-State Net Power Fusion Plant
Rimini Street, American Digital Team Up to Offer SAP, Oracle, VMware Support & Savings on HPE Infrastructure
Hamad Bin Khalifa University to Host Conference on AI Ethics

 

DNP to Open First Overseas R&D Center in the Netherlands
GCT Semiconductor Successfully Completes Sampling of 5G Chipsets and M...
European Commission Approves Tablet Formulation of BeOne Medicines¡¯ B...
Kioxia Sampling UFS Ver. 4.1 Embedded Flash Memory Devices
Board Achieves Microsoft Solutions Partner Designation with Azure Cert...
IQM to Integrate Quantum Computer Into Oak Ridge National Laboratory¡¯...
LG Expands AI Infrastructure Footprint Across Asia

 


°øÁö»çÇ×
´º½ºÁö ÇÑÀÚ Ç¥±â¿¡ ´ë¸¸½Ä À½Â÷ Ç¥±â '纽ÞÙó¢ ´Ï¿ì½ÃÁö' º´±â
º£³×ÇÁ·Ò º£³×ÀÎÅõ Áß¹® Ç¥±â 宝Ò¬ÜØÙÌ 宝Ò¬ì×öõ(ÜÄÒ¬ÜØÙÌ ÜÄ...
¹Ìµð¾î¾Æ¿ì¾î Mediaour ØÚ体ä²们 ØÚô÷ä²Ùú MO ¿¥¿À ØÚä² ØÚä²
¾Ë¸®¿ìºê Alliuv ä¹备: ä¹联êó备, ¾Ë¶ã Althle ä¹÷åìÌ
¾Ë¸®¾Ë Allial Áß¹® Ç¥±â ä¹××尔 ä¹××ì³
´ºÆÛ½ºÆ® New1st Áß¹® Ç¥±â 纽ììãæ(¹øÃ¼ Òïììãæ), N1 纽1
¿£ÄÚ½º¸ð½º : À̾¾ 'EnCosmos : EC' Áß¹® Ç¥±â ì¤ñµ
¾ÆÀ̵ð¾î·Ð Idearon Áß¹® Ç¥±â ì¤îè论 ì¤îèÖå
¹ÙÀÌ¿ÀÀÌ´Ï Bioini Áß¹® Ç¥±â ù±药研 ù±å·æÚ
¿À½ºÇÁ·Ò Ausfrom 奥ÞÙÜØÙÌ, À£ÇÁ·Ò Welfrom 卫ÜØÙÌ
¿¡³ÊÇÁ·Ò Enerfrom 额ÒöÜØÙÌ ¿¡³ÊÀ¯ºñ Eneruv 额Òöêó备
¾ËÇÁ·Ò Alfrom Áß¹® Ç¥±â ä¹尔ÜØÙÌ ä¹ì³ÜØÙÌ

 

ȸ»ç¼Ò°³ | ÀÎÀçä¿ë | ÀÌ¿ë¾à°ü | °³ÀÎÁ¤º¸Ãë±Þ¹æÄ§ | û¼Ò³âº¸È£Á¤Ã¥ | Ã¥ÀÓÇѰè¿Í ¹ýÀû°íÁö | À̸ÞÀÏÁÖ¼Ò¹«´Ü¼öÁý°ÅºÎ | °í°´¼¾ÅÍ

±â»çÁ¦º¸ À̸ÞÀÏ news@newsji.com, ÀüÈ­ 050 2222 0002, ÆÑ½º 050 2222 0111, ÁÖ¼Ò : ¼­¿ï ±¸·Î±¸ °¡¸¶»ê·Î 27±æ 60 1-37È£

ÀÎÅͳݴº½º¼­ºñ½º»ç¾÷µî·Ï : ¼­¿ï ÀÚ00447, µî·ÏÀÏÀÚ : 2013.12.23., ´º½º¹è¿­ ¹× û¼Ò³âº¸È£ÀÇ Ã¥ÀÓ : ´ëÇ¥ CEO

Copyright ¨Ï All rights reserved..